Mr. Harman is an SMT Engineer at ACDi and worked at Oven Industries as a Manufacturing Engineer. H's worked at Philips manufacturing ultrasound probes/circuitry. He holds three patents, one for an ultrasound probe design, and two for innovative rat/mouse zapper circuits. He attended Pennsylvania State University for Electrical Engineering.
Larry Harman has submitted responses to the following questions.
BGA reballing question
The SAC305 (96.5Sn/3.0Ag/0.5Cu) overwhelmingly consists of tin. The material that primarily creates the bond between lead free and leaded solder ...