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Larry Harman

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SMT Engineer

Mr. Harman is an SMT Engineer at ACDi and worked at Oven Industries as a Manufacturing Engineer. H's worked at Philips manufacturing ultrasound probes/circuitry. He holds three patents, one for an ultrasound probe design, and two for innovative rat/mouse zapper circuits. He attended Pennsylvania State University for Electrical Engineering.

Larry Harman has submitted responses to the following questions.
BGA reballing question
The SAC305 (96.5Sn/3.0Ag/0.5Cu) overwhelmingly consists of tin. The material that primarily creates the bond between lead free and leaded solder ...
Depaneling circuit board that contain BGA components
The component density on pcbs continues to increase with 2000, 3000 or more placements becoming the norm. Depaneling pcbs becomes ...