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Carlos Bouras

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General Manager
Nordson SELECT

Carlos Bouras is the General Manager of Nordson SELECT and has over 30 years of experience in the electronics manufacturing industry. Carlos's expertise is in process engineering, product development and manufacturing operations. For the past 15 years Carlos has focused specifically on automated assembly issues and is the holder of several US patents for non-contact dispensing and precision dispensing of adhesives for the packaging of microprocessor devices.


Carlos Bouras has submitted responses to the following questions.
How Do You Calculate Solder Paste Volume?
The issue that makes this complicated is the coplanarity variations between the tabs on the connector and the PCB itself. ...
Maximum Allowable Time Prior to Washing When Using Water Soluble Paste
It is difficult to provide guidance without knowing more information such as is the factory environment such as temperature and ...
Shelf Life Limit for Soldering Old Components
The IPC standard J-STD-002C, Solderability Tests for Components Leads, Terminations, Lugs, Terminals and Wires, addresses solderability testing that should be ...
Looking for Long-term Component Storage Options
Storage of components for ten years or longer is generally not a normal practice since most components are consumed on ...
Is There a Spec for LDI Mask thickness?
The generally accepted spec for LDI mask thickness is dependent upon the copper thickness within the circuit. For example these ...
Question About Dry Storage of PCBA's
Since you’re hand soldering the through-hole components it would appear your production volumes are relatively low. To avoid using a ...
Competing Reflow Oven Zones
Since most thermal profiler manufacturers have an extensive library of solder paste profiles, my first suggestion would be to contact ...
Exposed Copper Defect
Leaving exposed copper on a printed circuit board assembly is not recommend for any end application environment since copper quickly ...
BGA reballing question
While a single dynamic wave can be used to remove lead-free BGA solder balls before the re-balling process, it is ...
Depaneling circuit board that contain BGA components
Random or intermittent opens can occur within BGA or micro-BGA components during the de-paneling process if the devices are located ...
Tarnished OSP Circuit Boards
Even though OSP over bare copper has a significant cost benefit compared to other SMOBC board finishes, OSP is not ...
Pad Missing ENIG Plating
The most common reason for this to occur is that the fabricator could have micro-etch solution remaining in the holes. ...
IPC SOIC Defect Question
Ceramic components such as ceramic quad flat pack (CQFP) or other similar ceramic devices have a very low CTE (coefficient ...
Adding Chlorine to a DI (Deionization) Water System
We assume you're talking about a deionized reservoir for an aqueous cleaner. Adding chlorine will remove bacteria from the cleaner ...
Reflow Profile for Mixed Lead-Free and Leaded
It is highly recommended to follow the profile for the solder paste being used, so in this case one should ...
OA Flux Turning Blue
Since organic acid (OA) fluxes have a high activity level they are generally used for component lead tinning but are ...
Baking Concerns for Stacked Trays of Components
All moisture sensitive devices (MSDs) such as QFPs, TQFPs, TSOPs, etc. need to be baked before soldering based on their ...
Allowable Bow and Twist on Round PC Fab
The geometric tolerances specified in the IPC-A-600 standard should apply even if the board is routed in the shape of ...