Have 18 years of experience in electronic Industrialization. Specialties in PCB Design & manufacturing process, PCBA Process Development and Continuous Improvement.
Swaroop Pawar has submitted responses to the following questions.
BGA Component Grounding Problem
Perform an Dye-n-Pry test on BGAs. It should identify any cracks or separations within the solder joints that could lead ...
How to Re-qualify BGA Spheres
Recommend to perform Shear / Bend Test on entire PCBA to determine the Solder Strength on BGAs. Upon Shear test ...