Esterline Interface Technologies
Mr. Pierowski is currently a Process Engineer for SMT and Electrical Assembly with 20+ years of experience. A majority of the experience was based in screen/stencil printing for electronics manufacturing including application support for SMT, LTCC, HTCC and thick film.
Walter Pierowski has submitted responses to the following questions.
BGA Ball Sheer Testing
That is exactly the results I would expect from a mechanical removal of a BGA. Remember solder is designed to ...
ENIG Solderability Issues
Myfirst check would be for any contamination on the circuit board. I havein the past had issues when there was ...
One new technique is a localized cleanliness tester. There is one called C3 from Foresite. With this type of cleanliness ...