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Mike Green

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Design Engineering
Lockheed Martin Space Systems

Mike Green is co-chairman of the IPC Terms and Definitions Committee. He has been working with board design and manufacturing for 33 years.

Mike Green has submitted responses to the following questions.
BGA Joint Voids - Accept or Reject?
Here's my thoughts:That's the rattiest looking BGA joint I've ever seen, and I'veseen X-sections of hundreds of BGAs as-received as ...
Insufficient Barrel Fill on Through-hole Components
Guidance from IPC-2222 Revision A For better fill, some possible solutions are:a slower conveyor speed on the wave solder a ...
Fastening Surface Mounted Connectors Before or After Refow?
Applyingtorque to the fasteners of a connector that has been previously soldered willimpart stress to the solder joints. This is ...
Acceptable Conductor Repair
SeeIPC 7721, 4.2.4 Conductor Repair Surface Wire Method for amethodology. But, this method may not be acceptable for some types ...
Soldering Multilayer Ceramic Chip Capacitors
You need a controlled thermal environment to avoid cracking theceramic for both soldering operations. Use reflow with a controlled ramp ...
Soldering Wires to SMT Pads
We have a library part for #22 AWG that is .040 X .060. Our requirements are .050 minimum solder joint ...