Manager, Process Technology
Mr. Dimock is the manager of Process Technology at BTU International. His extensive experience in thermal processing includes positions at Corning, GE, and Sylvania. He has authored numerous articles on lead free processing and process control, taught classes at SMTAI, and participated in the IPC Reflow Oven Process Control Standard committee.
Fred Dimock has submitted responses to the following questions.
Competing Reflow Oven Zones
The first part concerns the paste specifications. Most profiling software has the ability to change the profile target on an ...
A Generic Reflow Profile
Being able to use a single reflow oven recipe for allproducts would be nice but it will certainly get you ...
SMT Component Shift
I would start by saying that something is different between the two process lines and you need to find out ...
Re-certify a reflow oven
I am not sure I understand what is meant by re-certifying the heat exhaust but when moving an oven to ...
Component Shift During Reflow
There are number of factors that can cause components to shift during reflow:Physical contact with curtains or hardware Excessive vibration ...