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Fred Dimock
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Manager, Process Technology
BTU International
Mr. Dimock is the manager of Process Technology at BTU International. His extensive experience in thermal processing includes positions at Corning, GE, and Sylvania. He has authored numerous articles on lead free processing and process control, taught classes at SMTAI, and participated in the IPC Reflow Oven Process Control Standard committee.

Fred Dimock has submitted responses to the following questions.
Channels To Reduce Voids in Large Pads
There are a number of ways to lower voids in the thermal pad of large devices. One is to provide ...
What Is Causing Connectors to Bow?
Bowing such as this is due to a difference in thermal expansion between the board and connector. When soldering they ...
Components Jumping Around During Reflow
I would look at the profile, especially the ramp rates. I suspect that you are heating too fast and causing ...
Blow Holes and Disturbed Joints
It is hard to diagnose a reflow problem without seeing a profile, but I would suspect that the heating rate ...
A Generic Reflow Profile
Being able to use a single reflow oven recipe for all products would be nice but it will certainly get ...
SMT Component Shift
I would start by saying that something is different between the two process lines and you need to find out ...
Reflow oven testing and calibrating concern
Numerous people have attempted to develop a standard test board for reflow ovens without success. Real world surface mount boards ...
Re-certify a reflow oven
I am not sure I understand what is meant by re-certifying the heat exhaust but when moving an oven to ...
Effect on Eutectic Melting point for a multiple alloy board
The simplest answer is that you get a mess. Consider this; if you take equal amounts of 10/90 tin-lead solder ...
How many zones are adequate for lead free profile
This is an interesting question. Profile attainment normally has two factors - amount of heat and time in the heat. ...
Optimize Temperature Profile for High Mix Board
Optimize is a complicated word. From a statistical viewpoint optimize could mean obtaining the highest CpK value on each step ...
Component Shift During Reflow
There are number of factors that can cause components to shift during reflow: Physical contact with curtains or hardware Excessive ...