Director - Certification & Assembly Technology
Mr. Crawford is Director of Certification and Assembly Technology for IPC. He is technical liaison to the IPC committees that maintain critical industry standards and has presented numerous papers internationally.
Jack Crawford has submitted responses to the following questions.
Passive component void limit
It is commonly recognized that voiding is likely to occur when any two flat surfaces are soldered together. Voids are ...
Which term to use, PWB or PCB?
This question has been discussed numerous times at IPC meetings and usually enables a fair amount of emotion.
All of ...
Component Rework Limit
There are too many variables involved with any decision about how many times an assembly or a specific connection can ...
Wiping the solder paste from a mis-printed circuit before machine cleaning is not advisable for two reasons:
1. Wiping mis-printed ...