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| May 21, 2013
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Circulation Over 51,000
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Mark Waterman
Engineer / Trainer
Electronic Controls Design, Inc. (ECD)
Mark Waterman is a trainer and field engineer with 17 years experience in service and applications specialties. Intimate knowledge of soldering processes and measurement systems. Six sigma and statistical process control generalist.
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Mark Waterman has submitted responses to the following questions.
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Jan 23, 2013
A Generic Reflow Profile
The short term justification is that it
saves time (change over and recipe generation), the same way as not performing ...
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Jan 23, 2013
Reflow Oven Calibration Schedule
Most manufacturing best practices say 1 year as
a general guideline, but ultimately this needs to be determined by your ...
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Aug 16, 2012
Mixing SAC305 and SACX0307 Solder Alloys
The
effects are unknown because you would really never know the exact alloy you are
working with at any given ...
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Jul 23, 2012
Cause of Cracking on SOT23 Components
As
only some of the parts are cracking, I would measure the thermal profile of
both the good and the ...
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Jul 11, 2012
Test for Flux Penetration
You
can use a paper on top of the board that is reactive to your specific
flux. This is the ...
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Mar 28, 2011
Ideal Relative Humidity for Final Assembly
Like most things it is a compromise. Higher humidity increases corrosion (oxidation) and reduces static. Low humidity reduces corrosion, but ...
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Mar 14, 2011
Lead Free Reflow Oven Zone Count
The number of zones allow for more control of the profile shape, and usually higher production speeds. The minimum number ...
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Feb 28, 2011
Batch Reflow vs. In-line Reflow
The real concerns here are the heating types, and work flows.
What type of heating does it use IR, convection, ...
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Feb 21, 2011
Board Spacing During Reflow
Convection reflow requires heated air pass around the board for proper heating. If the boards are run edge to edge, ...
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May 5, 2010
Solder Fillet Peaks
The peak is formed from the solder turning solidus as the tip is being removed. This indicates that the components ...
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Apr 19, 2010
APEX Trade Show Feedback
In general the mood was cautiously optimistic. Leading indicators and recent trends suggest that the worst is over, but many ...
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Mar 22, 2010
Solder Thieving Explanation
An observation first made with through hole components was that, as a row of leads or footprints leaves the wave ...
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Jan 25, 2010
What Is the Life Span for a Profile Board?
This is dependent on many factors including thermal exposure, substrate material, and even thermocouple attachment method.
In general for the ...
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