| May 24, 2013
|
| |
Circulation Over 51,000
|
|
May 22, 2013
Adding Weights to Small BGAs During Reflow
We have issues with small, light BGA's. They often have opens after reflow. We have no problems with larger ...
Responses by:
■ Neil Poole, Senior Applications Chemist, Henkel Electronics
■ Sandip Thakor, Quality Engineer, Matrix Telecom Solution P Ltd
■ Paul Austen, Senior Project Engineer, Electronic Controls Design Inc
■ Neil Poole, Senior Applications Chemist, Henkel Electronics
■ Karthik Vijay, Technical Manager, European Operations, Indium Corp.
|
May 20, 2013
Options for Reducing Dross
What are all the possible options we should explore to cut down on the amount of solder dross we see in our wave soldering system?
Responses by:
■ Edward Zamborsky, Regional Sales Manager, OK International Inc.
■ Terry Munson, President/Senior Technical Consultant, Foresite
■ EH Lim, Managing Director, Asia Pacific, ECD
■ Christian Ott, Sales Manager, Seho
■ Simon G. Norman, International Director, EVS International
|
May 15, 2013
Solder Bridging Problem on Header Connector
We have been struggling to eliminate solder bridging during wave soldering on a 10 x 2 row through hole ...
Responses by:
■ Todd O'Neil, Sales Manager, Soldering products, JUKI Automation Sys.
■ Alan Cable, President, ACE Production Technologies
■ EH Lim, Managing Director, Asia Pacific, ECD
■ Mike Schwartz, Director of Marketing, Manncorp
■ John Norton, Eastern Manager, Vitronics Soltec
|
May 13, 2013
Tombstoning Dilemma
We're having a problem with small chip tombstoning. The chips are lifting off one side. I know this issue ...
Responses by:
■ Georgian Simion, Operations Manager - A&E, AWS, Projects Unlimited, Inc.
■ Marc Peo, President, Heller Industries Inc.
■ Edward Zamborsky, Regional Sales Manager, OK International Inc.
■ Greg York, Technical Sales Manager, BLT Circuit Services Ltd
■ Paul J. Koep, Global Product Manager, Alpha - Cookson Electronics
■ Bryan Kerr, Principal Engineer - CMA Lab, BAE Systems
■ Dr. Brian Toleno, Application Engineering, Henkel Electronics
■ Bjorn Dahle, President, KIC
■ Paul Austen, Senior Project Engineer, Electronic Controls Design Inc
|
May 8, 2013
Lead-Free Profile Using Leaded Paste
We assemble a PCB that includes an 8 converter modules mounted close together. The converter modules are installed after ...
Responses by:
■ Brian O'Leary, General Manager, Trans-tec America LLC
■ Karthik Vijay, Technical Manager, European Operations, Indium Corp.
■ Allen W. Duck, CEO, ATEK llc
■ Paul Austen, Senior Project Engineer, Electronic Controls Design Inc
|
|
|
