| February 22, 2012
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Circulation Over 51,000
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February 22, 2012
IPC-A-610 Criteria
How did the Class 3 pass/fail criteria in IPC-A-610 come about? Was there field testing and or life cycle testing to support these requirements? If our products need to meet Class 3, but the heel fillets on one gull wing component do not comply with Class 3, but do meet Class 2, and if we do not rework the components, can we meet Class 3 if we conduct additional testing and the product passes the tests? What tests would we need to conduct?
Responses by:
■ Leo Lambert, Vice President, Technical Director, EPTAC Corporation
■ Garry McGuire, Sr. Engineer, NASA/Marshall Space Flight Center
■ Kris Roberson, Manager of Assembly Technology, IPC
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February 20, 2012
Soldering Multilayer Ceramic Chip Capacitors
We are conducting rework that includes soldering a wire to one end of a heat sensitive multilayer ceramic chip capacitor (MLCC). We need to solder the wire to one end of a ceramic chip cap while the other end is soldered to a PCB land. Since ceramic capacitors are sensitive to thermal shock, how should we proceed? Which end should be soldered first?
Responses by:
■ Garry McGuire, Sr. Engineer, NASA/Marshall Space Flight Center
■ John Vivari, Application Engineering Supervisor, Nordson EFD
■ Fritz Byle, Process Engineer, Astronautics
■ Paul Austen, Senior Project Engineer, Electronic Controls Design Inc
■ Kris Roberson, Manager of Assembly Technology, IPC
■ Bjorn Dahle, President, KIC
■ Mike Green, Design Engineering, Lockheed Martin Space Systems
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February 15, 2012
Acceptance Criteria for D-Pak Components
We are not sure about the acceptance criteria for D-Pak components whether end overhang is permitted or not. Is there a specific reference? Is this covered in IPC-A-610?
Responses by:
■ Leo Lambert, Vice President, Technical Director, EPTAC Corporation
■ Kris Roberson, Manager of Assembly Technology, IPC
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February 13, 2012
Idle Wave Solder Temperature
When our wave solder system is not in use, including after the workday and over the weekend, should we maintain the wave solder pot at a specific temperature?
If we allow the solder to cool to room temperature, then reheat to soldering temperature through many cycles, does it change the characteristics of the solder or the solder properties? What is the most common practice?
Responses by:
■ Leo Lambert, Vice President, Technical Director, EPTAC Corporation
■ Richard D. Stadem, Advanced Engineer/Scientist, General Dynamics
■ Fritz Byle, Process Engineer, Astronautics
■ Nick Koop, Product Manager, Minco Products Inc
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February 8, 2012
Insufficient Plated Hole Fill with Electrolytic Capacitors
We are having problems achieving the minimum hole of 75% on electrolytic capacitors using our wave soldering. What do you suggest.
Responses by:
■ Paul J. Koep, Global Product Manager, Alpha - Cookson Electronics
■ Greg York, Technical Sales Manager, BLT Circuit Services Ltd
■ Rodney Miller, Capital Equipment Operations Manager, SCS Coatings
■ Leo Lambert, Vice President, Technical Director, EPTAC Corporation
■ Peter Biocca, Senior Market Development Engineer, Kester
■ Fritz Byle, Process Engineer, Astronautics
■ Subrat Prajapati, Supplier Quality Leader, Ge Healthcare
■ Lee Levine, President, Consultant, Process Solutions Consulting Inc
■ Terry Munson, President/Senior Technical Consultant, Foresite
■ Gerard O'Brien, President, S T and S Testing and Analysis
■ Kris Roberson, Manager of Assembly Technology, IPC
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