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June 9, 2010

Lead to Hole Ratio for Selective Soldering

Does the lead to hole ratio for a selective soldering process vary from a standard wave soldering process?

What is the proper lead to hole ratio for selective soldering to achieve good solder flow and proper fillet formation?



F. L.

Experts Comments

The short answer is that the requirements are the same as a previous expert response on wave soldering (Recommended lead to hole ratio).

You need to have sufficient lead below the pad to grasp and conduct the heat from the solder to the top side, but you also need reasonable pin to hole clearance for the solder to flow upwards unrestricted.

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Alan Cable
President
ACE Production Technologies
Alan Cable, Past President-Retired, ACE Production Technologies has over 40 years experience in the electronics manufacturing arena. Alan's expertise is high production manufacturing automation, equipment design and process engineering. For the past 25 years Alan has focused specifically on soldering issues relating to component solderability, lead tinning and selective soldering, owning several companies with this focus.

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