Reuse of any component is not recommended unless the device undergoes testing to ensure absence of inherent defects that may not be immediately discernable.

Reusing components which have been removed from any printed circuit board is risky at best, due to the thermal excursion the component experienced through the assembly cycle and the removal cycle.

Although the thermal profile is predetermined during the assembly process it many times is not during the removal and replacement cycle, which could introduce latent failures in the component.

The other issue which needs to be addressed and this is an issue we faced many years ago at a computer company, is the product cannot be sold as new equipment, as all the components within the system are not new, some have been removed and reinstalled, so the system has to be sold with the caveat "like new."

I know it is a small point but within the limits of the law, it is a point to consider when making the decision to re-use removed components.