You can get decent results but not equally good results. The rinse will be more active and do a better job in a shorter period of time. The old rule of thumb, double the activity for every 10 degree C rise in Temp applies here.

You have to find your own sweet spot however. Perhaps some SIR testing at different temps is in order if you really want to find that sweet spot for your operation.

Surface tension of water can be reduced and its solvency can be increased by increasing its temperature. Hot rinse water has better capability of creeping underneath components and rinsing off potentially re-deposited contaminants faster from the wash cycle.

I would strongly recommend heated DI water as some wetting agents used in fluxes will Gel if hit with cold water instead of heated. Also heating the water will aid drying times considerably. Recommend 45-50C water.

I'm not too sure about heating water to make it more searching for low standoff components but adding a small amount of Saponifier/cleaning agent will help with this considerably and neutralise any activators present.

The answer is "It depends"...

Hot water will dissolve residues more quickly than cold water. In a time-critical process step, hot water will be more efficient from a through-put standpoint.

Also, materials will typically be more soluble in hot water than in cold. So, cleaner and faster with hot water, in general..And, yes, hot water will have a lower surface tension.

In nearly every circumstance, hot water (120-150F) will be better than room temperature water (70-80F) in terms of removing residues from soldering processes. While the surface tension concern that you mention is one aspect in this equation, the fact that solubility of most organic materials is better in hotter water is another strong case for going with hotter water.

The greater solubility of organic materials in hotter water generally means that you will have better luck removing residues in hot water than room temperature water.