Circuitnet Logo
   We search for industry news, so you don't need to.
May 17, 2012
Circulation Over 51,000
Ask the Experts Index
You submit the questions, our Panel of Experts submit the answers.
Questions  I   Submit a Question  I   Experts Panel  I   Join the Panel
September 21, 2009
Problems with blow holes

We are having problems with what appear to be blow holes on one particular part of an assembly we run frequently.

We have experimented with different profiles and different no-clean fluxes with no results. We also baked the boards.

Could the cause be due to an improper ratio of the lead to the hole? Are there specifications for lead to hole ratios for wave soldering?



R. G.

Experts Comments

Lead To hole Ratios are fairly important but not normally a cause for Blow Holes.

If you are using Single Sided PCBs then many things are blamed on lead to hole ratios, when in fact the problem is incorrect drilling leaving a laminate burr inside the hole wall which then naturally de wets solder.

If the problem is with PTH boards then this can be caused by HASL fluids attracting moisture into the holes, sometimes baking works, but sometimes there is too much high boiling solvents left to bake out as they are there to withstands high temperature so stands to reason they cannot be baked out.

This can be tested for as if you leave an Iron tip for 4-5 seconds on the blown joint you will see an acrid smoke come off with the solder fizzing and popping and a black spec appear on the molten solder normally.

If it is only in a certain area of the PCB then it could more likely be thin plating so you get hole wall break out, get that area micro sectioned and wall plating including Copper thickness tested.

If the PCB is Silver Finish then this too can produce blow holes and the only thing that really helps is to flow the PCB twice, we believe there is resist sometimes improperly removed or leached/bled over the holes and by soldering it twice this actually removes the residue and gives an improved solder joint.

Would be helpful to know what solder finish PCB is and what type i.e. single or double sided.

Hope it helps

Greg York
Technical Sales Manager
BLT Circuit Services Ltd
Greg York has twenty two years of service in Electronics industry. York has installed over 350 Lead Free Lines in Europe with Solder and flux systems as well as Technical Support on SMT lines and trouble shooting.

The blow holes are not really related to the ratio. The recommended hole diameter for laedfree is 0,3mm bigger then the component lead.

Most of the time the blow holes are related to the PCB. Since you tried different parameter and fluxers you may consider a different way.

I had good success with the same problem by running the process temperatures on the lower end. Specially the solder bath temperature as low as 260C and the contact time as short as possible. The preheat was just 100C.

If possible I would try to use a different PCB supplier.

image
Christian Ott
Sales Manager
Seho
Christian Ott knows electronic manufacturing companies around the world and their specific requirements. He has hands on experience with Selective, Reflow and Wave soldering processes.

Blow holes have many causes. One possible cause is air escaping from between the layer of the PCB through pin holes in the barrel of the plated through hole. This will happen no matter how much you pre-bake the board because it's air and not moisture being forced out as the board heats.

The only solution is to look to your board vendor to make sure the through-hole plating is 100% with no pin holes.

The IPC publishes manyquality and inspection documents for the electronics manufacturing industry. I think theIPC-2221A "Standard for Printed Board Design" will have the hole to lead ratio recommendation.

image
Paul Austen
Senior Project Engineer
Electronic Controls Design Inc
Paul Austen is a 30 year veteran Senior Project Engineer with ECD in Milwaukie, Oregon. Paul has seen and worked with the electronic manufacturing industry from many points of view, including: technician, designer, manufacture, and customer.

Many times this can be caused by humidity or any water on the PCB.

image
Todd O'Neil
Sales Manager, Soldering products
JUKI Automation Sys.
Mr. O'Neil has been part of the electronics manufacturing field for 17 years. As Sales Manager for all Soldering products at JUKI, his main objective is to continue to supply equipment providing the "Lowest Cost of Ownership."
Additional Comments
Reader Comments

The issue you describe is a blow hole but not one as a result of a PCB fab issue. What is happening in your case is the volatiles in the flux normally escape through the through hole but the clinch of the component lead actually traps some of the gases causing them to release in the solder wave and explode.

Ray Chartrand

 


Depending on the part type, maybe a capacitor that uses the brown sheathing protection which underlap under the bottom, you could be forming a gasket during the wave process and pushing air back out through the holes.

I ran into this problem years ago and started placing glue dots under the part to let air escape. The parts (mainly caps) that are nailed to the board trap air underneath and during soldering at high temp will push the air back out of the barrels.

R. M.

Submit a comment - Add to the discussion.

Your Name
Your Email
Company
Country
Comment
  All comments are reviewed prior to posting. We will only post a comment that includes a name and company. You will receive an email if your comments are posted.
Authentication
Please type the number displayed into the box. If you attempt to submit information and receive an error, you may need to refresh the page and insert the information again.
 
Home  |  About Us  |  Advertising  |  Advertising Rates  |  Ask the Experts  |  Calendar  |  Contact Us  |  Free Subscription
Industry Forums  |  Exclusives  |  Letters  |  News  |  Press Releases  |  Viewpoint  |  White Papers
We search for industry news so you don't need to. Circuitnet LLC, 22 Parkridge Road, Haverhill, MA 01835 USA
Copyright © 2012 Circuitnet.    All rights reserved.
Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager

Semiconductor Packaging News - Semiconductor and advanced packaging news and information.