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iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE
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Cold Underfill Component Removal
A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
Air-Vac Engineering
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| Ask the Experts |
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August 17, 2009 - Updated
August 17, 2009 - Originally Posted
Fine pitch through hole soldering
What is the finest pitch for plated through hole components that can be succesfully wave soldered without bridging?
If you don't have a specific dimension, can you let me know the finest pitch through hole component you have soldered succcessfully?
A. N.
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| Expert Panel Responses |
With a Selective Soldering machine you have more control of your parameters and axis which makes it easier to have success soldering fine pitch components. 1.27mm fine pitch soldering occurs on a daily basis, but soldering well below 1mm pitch can also be achieved with a very high FPY.
Todd O'Neil
National Sales and Marketing Manager, North America
Business Development Manager, DAGE | X-Ray component counting
Mr. O'Neil has been in the electronics manufacturing industry for over 20 years.
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IC Programming: Memory & Logic Devices
Full support of all package types. Support for all major semiconductor manufacturers. Full dry-pack capabilities to support moisture sensitive products.
Alltemated
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