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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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| Ask the Experts |
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August 17, 2009 - Updated
August 17, 2009 - Originally Posted
Fine pitch through hole soldering
What is the finest pitch for plated through hole components that can be succesfully wave soldered without bridging?
If you don't have a specific dimension, can you let me know the finest pitch through hole component you have soldered succcessfully?
A. N.
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| Expert Panel Responses |
With a Selective Soldering machine you have more control of your parameters and axis which makes it easier to have success soldering fine pitch components. 1.27mm fine pitch soldering occurs on a daily basis, but soldering well below 1mm pitch can also be achieved with a very high FPY.
Todd O'Neil
National Sales and Marketing Manager, North America
Business Development Manager, DAGE | X-Ray component counting
Mr. O'Neil has been in the electronics manufacturing industry for over 20 years.
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Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology, Inc.
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