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| February 9, 2012
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Circulation Over 51,000
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July 8, 2009
How to predict possible intermetallics
How can we predict the possible intermetallics that will form from two alloys?
Would it be a function of temperature?
C. T.
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Growth of intermetallics is a function of the temperature and the time for which the solder is molten - the longer the time the solder is molten, more intermetallics are formed.
The composition of the intermetallics is a function of the solder alloy and the substrate metallizations the solder is bonding to.
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Karthik Vijay
Technical Manager, European Operations
Indium Corp.
Karthik Vijay is the Technical Manager for Indium Corporation's European Operations. He is based in the UK and is responsible for technology programs and the technical support function for Indium Corporation's customers in Europe. His expertise is focused on solder paste, engineered solders, thermal interface materials, and semiconductor-grade electronics materials.
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There is a lot of information available on intermetalic interactions.
A book I have used as a reference for years is the Constitution of Binary Alloys (Paperback) by Max Hansen (Author), Kurt Anderko (Author).
I think its currently out of print, but Amazon has used copies.
You may also want to search the web for "Phase diagrams of alloys."
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Steven Adamson
Market Specialist
Nordson ASYMTEK
Market Specialist for Nordson ASYMTEK. Mr. Adamson worked for Kodak, Motorola and Plessey, ICL in the UK with 5 US and 2 UK patents. He was awarded a HNC in electrical engineering and was 2008 President of IMAPS. Mr. Adamson was a respected mentor in the electronics industry. He passed away October, 2011. Learn about the Steve Adamson Memorial Annual Scholarship Fund.
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The formation of intermetallics depends on the elements in the solder alloy composition, the surface finish of the PCB pads and the finish of the component leads or solder ball composition.
The formation of intermetallics also depends on the appropriate soldering temperature and the time the solder remains in a molten state during soldering. The binary or ternary metallurgical equilibrium diagram with the metal elements will show the possible intermetallics and also the composition of the internmetallics.
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Brian O'Leary
General Manager of International Sales
KIC
Brian O'Leary is responsible for KIC's international customers and distribution in Latin America, EMEA, Russia, India, Australia and New Zealand for the thermal management and process control portion of the electronics assembly and packaging processes.
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