Circuitnet Logo
   We search for industry news, so you don't need to.
February 9, 2012
Circulation Over 51,000
Ask the Experts Index
You submit the questions, our Panel of Experts submit the answers.
Questions  I   Submit a Question  I   Experts Panel  I   Join the Panel
June 1, 2009

Cause of Blow Holes During Wave Soldering

When wave soldering radial lead LED's, we are seeing blow holes. We have found that loosening the clinch applied by the placement machine resolves the blow hole issue.

Any ideas why the tight clinch may be causing blow holes?

M. J.

Experts Comments

Most likely this is being cause by no escape route for the flux gas when the PCB enters the wave. If the clinch is too tight or there is no escape path the flux gas will escape out the bottomside barrel when the unit exits the wave.

A tight clinch will pull the LED tight/flush to the board surface and not allow for the gas to escape leaving what looks like a blow hole.

I hope this helps.

John Norton
Eastern Manager
Vitronics Soltec
John Norton started his soldering career in 1983 for Hollis Engineering. He has also worked with Electrovert as a technical training manager and Vitronics Soltec for the last ten years. He has held various technical development and sales positions.

It is possible that if the clinch is too tight then the LED will form/sit over the top of the hole not allowing the hot gasses to escape from the flux and other items during wave soldering. Loosening the clinch a little may help in allowing the gasses to escape from the top of the joint.

Greg York
Technical Sales Manager
BLT Circuit Services Ltd
Greg York has twenty two years of service in Electronics industry. York has installed over 350 Lead Free Lines in Europe with Solder and flux systems as well as Technical Support on SMT lines and trouble shooting.

Sounds to me that the tight clinch is acting as a dam preventing the flow of both the flux and the solder thru the vias. When you relax the clinch the materials flow smoothly eliminating the blow holes.

image
Edward Zamborsky
Regional Sales Manager
OK International Inc.
Mr. Zamborsky serves as one of OK's technology advisers to the Product Development group. Ed has authored articles and papers on topics such as; Low Volume SMT Assembly, Solder Fume Extraction, SMT Rework, BGA Rework, Lead Free Hand Soldering, Lead Free Visual Inspection and Lead Free Array Rework.
Additional Comments
No additional comments have been submitted.

Submit a comment - Add to the discussion.

Your Name
Your Email
Company
Country
Comment
  All comments are reviewed prior to posting. We will only post a comment that includes a name and company. You will receive an email if your comments are posted.
 
Home  |  About Us  |  Advertising  |  Advertising Rates  |  Ask the Experts  |  Calendar  |  Contact Us  |  Free Subscription
Industry Forums  |  Exclusives  |  Letters  |  News  |  Press Releases  |  Viewpoint  |  White Papers

Search Category       Search Term   
To search a phrase, place it in quotes.
We search for industry news so you don't need to.

Circuitnet LLC, 22 Parkridge Road, Haverhill, MA 01835 USA
Copyright © 2012 Circuitnet.    All rights reserved.
Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager

Semiconductor Packaging News - Semiconductor and advanced packaging news and information.