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February 10, 2012
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May 28, 2009

Difference between shiny and matt solder resist

Are there differences in processing parameters and cost for shiny and matt solder resists in PCB manufacturing?

Why does it seem that the shiny solder resist attracts more solder balls during wave soldering?

Why do most PCB houses choose shiny solder resist as standard material?

T. S. Y.

Experts Comments

Yes there are differences between the two types of finishes of solder mask.

If you plan to underfill devices I believe you will have better adhesion of the epoxies to the mat surface finish.

image
Steven Adamson
Market Specialist
Nordson ASYMTEK
Market Specialist for Nordson ASYMTEK. Mr. Adamson worked for Kodak, Motorola and Plessey, ICL in the UK with 5 US and 2 UK patents. He was awarded a HNC in electrical engineering and was 2008 President of IMAPS. Mr. Adamson was a respected mentor in the electronics industry. He passed away October, 2011. Learn about the Steve Adamson Memorial Annual Scholarship Fund.

Yes, there are process differences between the two types of mask although there isn’t a difference in the price. The matte masks seems to have a harder time to wet as there is a roughened surface on the finish, thus the ball is less susceptible to stick. I

I believe the glossy mask is a bit tougher so you have less of a tendency for the mask to scratch in process. In the market we mostly see a semi matte version which is a combination of the glossy and the matte masks.

image
Mike Scimeca
President
FCT Assembly
Mike Scimeca created FCT Assembly after the purchase of Fine Line Stencil, Inc., and consists of two major operations: stencil manufacturing and the manufacturing of electronic assembly products such as solder paste, flux and solder bar.
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