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| February 10, 2012
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Circulation Over 51,000
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March 4, 2009
Measuring component height after reflow
I have an SMT component that has a height of 8 mm with a stencil thickness of 5mm. We are using lead free solder paste, the pad size is 11"x.054".
Is there a method for determining the overall height of the component on the board after reflow?
Cameron Shutts
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I would suggest using a VPI-1000 from Easybraid. Once the assembly is reflowed you can simply measure the height.
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Edward Zamborsky
Regional Sales Manager
OK International Inc.
Mr. Zamborsky serves as one of OK's technology advisers to the Product Development group. Ed has authored articles and papers on topics such as; Low Volume SMT Assembly, Solder Fume Extraction, SMT Rework, BGA Rework, Lead Free Hand Soldering, Lead Free Visual Inspection and Lead Free Array Rework.
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Reader Comments
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I would like to ask about the thermal profile. Should I follow the recommended profile for the solder paste exactly? If not, what are the factores I have to follow when creating new thermal profile?
N. A.
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