Basically you are going to paste the boards, then apply a UV cured adhesive to the first side, place the components and then cure the adhesive. Flip the board, paste, place, reflow.
The key is a UV cured epoxy. If you use a slower, heat cured epoxy you are defeating the purpose of the process.
Overall it will probably save a few minutes off of the reflow process time. The question is, is the capital for an additional machine, plus the floor space for the glue dot placement available. Remember, you are adding a machine to the line in the form of the glue placement. The UV cue oven may be a little smaller, depending on design so you could balance the floor space requirement there.
