It is nearly impossible to accurately "solder bump" these components back into place on your PCB. Sure you might have one operator who can achieve satisfactory results, but it will never be reliable enough to meet your quality requirements.

For best and repeatable results, you need to remove all residual solder from the site, be sure to clean the site so there are no flux residues.

Then print the new solder paste directly onto the pads of the component, ensuring the correct volume for the central grounding pad (too much and the component will float during reflow), pick the component from the paste printing plate with your rework system, align it to the pads on the PCB and place the component. Reflow with the correct thermal profile.

I think your problem with solder bumping is how much solder is in the bump.

Can you be sure you have bumps at the same height?

With paste you have a self leveling effect because the pump on the will displace the paste.