Circuitnet Logo
   We search for industry news, so you don't need to.
February 10, 2012
Circulation Over 51,000
Ask the Experts Index
You submit the questions, our Panel of Experts submit the answers.
Questions  I   Submit a Question  I   Experts Panel  I   Join the Panel
February 4, 2008

Voiding after under-fill

During our under-fill process we are noticing voiding after the fact.

Is there a tool used to see or test for voiding in an under-fill process?

 Ray Whittier

Experts Comments

The primary tool for this activity would be acoustic microscopy. There are primarily two companies in this space: Sonix and Sonoscan. You could also possibly use an infrared camera if the underfill is used for heat dissipation.
image
Dr. Craig D. Hillman
CEO & Managing Partner
DfR Solutions
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.
Additional Comments
No additional comments have been submitted.

Submit a comment - Add to the discussion.

Your Name
Your Email
Company
Country
Comment
  All comments are reviewed prior to posting. We will only post a comment that includes a name and company. You will receive an email if your comments are posted.
 
Home  |  About Us  |  Advertising  |  Advertising Rates  |  Ask the Experts  |  Calendar  |  Contact Us  |  Free Subscription
Industry Forums  |  Exclusives  |  Letters  |  News  |  Press Releases  |  Viewpoint  |  White Papers

Search Category       Search Term   
To search a phrase, place it in quotes.
We search for industry news so you don't need to.

Circuitnet LLC, 22 Parkridge Road, Haverhill, MA 01835 USA
Copyright © 2012 Circuitnet.    All rights reserved.
Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager

Semiconductor Packaging News - Semiconductor and advanced packaging news and information.