To address the DI water resistivity question for proper defluxing with water the higher the resistivity the better (we currently start with 18 meg ohm), but will still clean with 4 meg ohm or better.
This typically takes a longer rinse time and elevated temperature. The effect of any ionic residues of 100 ppb or more in critical areas can lead to leakage and stray voltage problems. Chloride, fluoride, sulfate, sodium, calcium, iron, and ammonia all can have individual and collective impacts on the electrical performance.
This is why cleaning and rinsing with the best water quality available creates the best conditions for cleaning not only flux residues, but board and component fabrication residues. One last point on cleaning is the fact that surface tension of water is high and has limitations getting under some low standoff components.
Remember it is not the cleanliness of the entire board that causes the electrical failure but he amount of residue between two pads on a critical circuit the define the cleanliness of the assembly.