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| February 10, 2012
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Circulation Over 51,000
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April 2, 2007
Lead-free connector rework
I'm looking for process guidelines to remove a lead-free Mictor connector on a lead-free PCBA. The PCB thickness is 0.100 mils and Mictor ground pins are not protruded on bottom side.
The challenge is having the sm pads and pth pins at the same time in reflow without overheating the PCB.
All recommendations are welcome.
Yves Desrochers
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Flextronics already has some sites equipped with a Laser Rework system from ViTechnology.
This is a contact less system with extremely good heat transfer which may be able to be used for this application. If you email me I can give you some contacts within Flextronics sites in Europe and Asia.
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Mark Norris
Executive Vice President Sales & Marketing
ViTechnology
With over 20 years experience in the electronics industry, vice president sales & marketing for Camelot systems and more recently Exec. V.P. for ViTechnology a leading AOI company, Mr. Norris has been exposed to many aspects of the assembly process.
NOTE: Mr. Noris is no longer working at ViTechnology.
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There is only one method I can identify for this type of application, the pcb will require substantial bottom side heat, combined with a convection top heater with mechanical lifting capacity.
The APR-5000-XLS machine has the ability to concentrate the bottom heating to a small location on the board and the tweezer convection nozzles will grab and lift this part from the board with programmable accuracy.
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Edward Zamborsky
Regional Sales Manager
OK International Inc.
Mr. Zamborsky serves as one of OK's technology advisers to the Product Development group. Ed has authored articles and papers on topics such as; Low Volume SMT Assembly, Solder Fume Extraction, SMT Rework, BGA Rework, Lead Free Hand Soldering, Lead Free Visual Inspection and Lead Free Array Rework.
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