PARMI

SPI & AOI Inspection Moves to the Next Level!

SPI & AOI Inspection Moves to the Next Level
We own High Mix Low Volume SPI. and Hi-Rel printing inspection!

Our SPI will completely validate your solder paste printer is changed over correctly on the 1st PCBA! If not, we tell you why and how to recover from the error(s). This analysis is done without loss of inspection speed.

No "Closed Looping" to the printer is required!

Our Solder Paste Dispenser allows you to recover from insufficient paste deposits while still in our SPI. No need to exhaust, clean and reprint the PCB. This is an invaluable capability for small Area Aperture Ratio (AAR) prints, CSP's and Micro-BGA's.

SPI & AOI Inspection Moves to the Next Level
AOI - Inspect the full range of devices from 0201(Metric) to 40mm without special options or inspection speed loss. All of this is while maintaining +/- 3 microns repeatability on Z axis!

Program to discover Foreign Object Debris (FOD) in less than 2 minutes regardless of PCBA size or component density!

SPI & AOI Inspection Moves to the Next Level
Please visit us at IPC APEX, booth #3416 for demonstrations of this technology in less than 15 minutes.

To make an appointment, please contact Jessica Jurek at JJurek@parmiusa.com

PARMI USA Inc.
9853 Pacific Heights Blvd, Suite N, San Diego, CA 92121 Tel 858-683-0225

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Circuitnet Media, LLC
6 Liberty Square #2040, Boston MA 02109 USA