White Paper Download Index Mixed Attachment Technology Studies in RF & Optoelectronic Packages This paper explores a range of case studies that demonstrate both eutectic and adhesive assembly and the results for closely spaced components. An overview of the technology and accurate placement method is presented for eutectic and adhesive-based attachment for components ranging from 0.18mm x 0.18mm x 0.20mm Si die to 1.7mm x 1.4mm x 0.16mm GaAs die. Palomar Technologies Complete the form below. After you hit submit you will be redirected to the White Paper page. Please be patient, it may take a few seconds for the White Paper to load. Page views: 1017 White Paper Submission Guidelines - White Paper Submit Form Semiconductor Packaging News reaches industry professionals involved in semiconductor packaging and microelectronics. If you have a technical white paper, post at no cost for readers to learn more about your technology. Our readers are interested in technical solutions. White Papers should not promote the sale of a product or service. Please limit your White Paper length to 5 pages or less. Keep the reader in mind - shorter is always better. White Papers should be submitted as PDF files less than 2 Megs.