White Paper Download Index Enabling Thinner Packages through Novel Materials Innovations New developments in semiconductor packaging materials are enabling continued miniaturization of modern electronics processes. Advances in die attach films, wafer backside coating (WBC) technologies, wafer applied underfills (WAUF) and non-conductive pastes (NCP) are all making small form factor devices possible.    Henkel Electronic Materials, LLC Complete the form below. After you hit submit you will be redirected to the White Paper page. Please be patient, it may take a few seconds for the White Paper to load. Page views: 1899 White Paper Submission Guidelines - White Paper Submit Form Semiconductor Packaging News reaches industry professionals involved in semiconductor packaging and microelectronics. If you have a technical white paper, post at no cost for readers to learn more about your technology. Our readers are interested in technical solutions. White Papers should not promote the sale of a product or service. Please limit your White Paper length to 5 pages or less. Keep the reader in mind - shorter is always better. White Papers should be submitted as PDF files less than 2 Megs.