White Paper Download Index How to Deal with Resonances in Wirebonding Resonance effects can impede or prevent wire bond formation. The major kinds of resonance are discussed: sharp resonances on eigenfrequencies and passive, following resonances. Changing the ultrasonic frequency removes the true resonance while the passive resonance is independent of the US frequency... F & K Delvotec Complete the form below. After you hit submit you will be redirected to the White Paper page. Please be patient, it may take a few seconds for the White Paper to load. Page views: 3230 White Paper Submission Guidelines - White Paper Submit Form Semiconductor Packaging News reaches industry professionals involved in semiconductor packaging and microelectronics. If you have a technical white paper, post at no cost for readers to learn more about your technology. Our readers are interested in technical solutions. White Papers should not promote the sale of a product or service. Please limit your White Paper length to 5 pages or less. Keep the reader in mind - shorter is always better. White Papers should be submitted as PDF files less than 2 Megs.