White Paper Download Index FC300R High Accuracy Bonder with Robotics Ideal for high accuracy C2W bonding for 3D integration, the FC300R features Face-to-Back or Face-to-face Alignment (flip-chip). The system, with high level of automation, can handle a wide range of components. Unrivalled process flexibility, precision and repeatability. SET - Smart Equipment Technology Complete the form below. After you hit submit you will be redirected to the White Paper page. Please be patient, it may take a few seconds for the White Paper to load. Page views: 749 White Paper Submission Guidelines - White Paper Submit Form Semiconductor Packaging News reaches industry professionals involved in semiconductor packaging and microelectronics. If you have a technical white paper, post at no cost for readers to learn more about your technology. Our readers are interested in technical solutions. White Papers should not promote the sale of a product or service. Please limit your White Paper length to 5 pages or less. Keep the reader in mind - shorter is always better. White Papers should be submitted as PDF files less than 2 Megs.