White Paper Download Index Controlling Pressure for Coplanarity & Bonding Flip Chip A recent conference paper shows the advantages of using Pressurex® pressure-indicating sensor film in wafer-to-wafer bonding. The film also may have similar advantages for several applications in flip chip assembly where pressure magnitude and spatial uniformity may be critical. Sensor Products Inc. Complete the form below. After you hit submit you will be redirected to the White Paper page. Please be patient, it may take a few seconds for the White Paper to load. Page views: 1282 White Paper Submission Guidelines - White Paper Submit Form Semiconductor Packaging News reaches industry professionals involved in semiconductor packaging and microelectronics. If you have a technical white paper, post at no cost for readers to learn more about your technology. Our readers are interested in technical solutions. White Papers should not promote the sale of a product or service. Please limit your White Paper length to 5 pages or less. Keep the reader in mind - shorter is always better. White Papers should be submitted as PDF files less than 2 Megs.