White Paper Download Index Exceeding Productivity Demands for Heavy Wire Bonding A large portion of the cycle time for wedge bonding, is used for the ultrasonic welding process. To achieve an increase in productivity equipment manufacturers must question each element of the wire bonding equipment in relation to optimizing the wire bonding process. The article reviews critical elements & questions. Hesse Mechatronics Complete the form below. After you hit submit you will be redirected to the White Paper page. Please be patient, it may take a few seconds for the White Paper to load. Page views: 1867 White Paper Submission Guidelines - White Paper Submit Form Semiconductor Packaging News reaches industry professionals involved in semiconductor packaging and microelectronics. If you have a technical white paper, post at no cost for readers to learn more about your technology. Our readers are interested in technical solutions. White Papers should not promote the sale of a product or service. Please limit your White Paper length to 5 pages or less. Keep the reader in mind - shorter is always better. White Papers should be submitted as PDF files less than 2 Megs.