San Diego — KIC, the leader of thermal process development and control products, and winner of multiple industry awards, will share the latest science and products for reliable nondestructive methods of profiling in booth #1549 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas, NV.

KIC and the Rochester Institute of Technology have completed a groundbreaking study in the field of thermocouple attachment that explores methods of creating offsets in place of drilling holes and other destructive means for high interest components, such as BGAs. Additionally, hard science on the best attachment method of thermocouple attachment is also covered in this report. Be sure to request a copy of this report, as well as explore some of the hardware and software options currently on the market for non-destructive profiling.

Also, do not forget to stop by the booth to take a shot at KIC’s man vs. machine game and beat KIC’s auto-prediction Navigator for a chance to win prizes, including the new Apple iPad.