White Paper Download Index Equipment for UV processes combined with thin wafer handling Introduction of a unified equipment platform for UV initiated processes in conjunction with the application of electrostatic carriers as thin wafer handling solution. This paper introduces the new MA8 Gen3 Aligner generation designed specifically for the development of 3D and MEMS packaging technologies. SUSS MicroTec Complete the form below. After you hit submit you will be redirected to the White Paper page. Please be patient, it may take a few seconds for the White Paper to load. Page views: 999 White Paper Submission Guidelines - White Paper Submit Form Semiconductor Packaging News reaches industry professionals involved in semiconductor packaging and microelectronics. If you have a technical white paper, post at no cost for readers to learn more about your technology. Our readers are interested in technical solutions. White Papers should not promote the sale of a product or service. Please limit your White Paper length to 5 pages or less. Keep the reader in mind - shorter is always better. White Papers should be submitted as PDF files less than 2 Megs.