White Paper Download Index Achieving Thermal Control for Power Devices Die attach solder pastes for varying requirements allow package designers and assemblers ensure that proper thermal control is built into advanced electronics packages associated with smaller device footprints and higher I/O counts. Henkel Electronic Materials, LLC Complete the form below. After you hit submit you will be redirected to the White Paper page. Please be patient, it may take a few seconds for the White Paper to load. Page views: 745 White Paper Submission Guidelines - White Paper Submit Form Semiconductor Packaging News reaches industry professionals involved in semiconductor packaging and microelectronics. If you have a technical white paper, post at no cost for readers to learn more about your technology. Our readers are interested in technical solutions. White Papers should not promote the sale of a product or service. Please limit your White Paper length to 5 pages or less. Keep the reader in mind - shorter is always better. White Papers should be submitted as PDF files less than 2 Megs.