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The evolution of today's IC test solution
Semiconductor packages have I/O counts increasing & pitches between the I/O reducing. Processing speed for most packages are increasing requiring IC test Socket design to change. A new product has evolved to enable easier socket design & manufacture. Learn more... A-Tek llc Complete the form below. After you hit submit you will be redirected to the White Paper page. Please be patient, it may take a few seconds for the White Paper to load. | ||
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