White Paper Download Index The evolution of today's IC test solution Semiconductor packages have I/O counts increasing & pitches between the I/O reducing. Processing speed for most packages are increasing requiring IC test Socket design to change. A new product has evolved to enable easier socket design & manufacture. Learn more... A-Tek llc Complete the form below. After you hit submit you will be redirected to the White Paper page. Please be patient, it may take a few seconds for the White Paper to load. Page views: 659 White Paper Submission Guidelines - White Paper Submit Form Semiconductor Packaging News reaches industry professionals involved in semiconductor packaging and microelectronics. If you have a technical white paper, post at no cost for readers to learn more about your technology. Our readers are interested in technical solutions. White Papers should not promote the sale of a product or service. Please limit your White Paper length to 5 pages or less. Keep the reader in mind - shorter is always better. White Papers should be submitted as PDF files less than 2 Megs.