White Paper Download Index
The evolution of today's IC test solution

Semiconductor packages have I/O counts increasing & pitches between the I/O reducing. Processing speed for most packages are increasing requiring IC test Socket design to change. A new product has evolved to enable easier socket design & manufacture. Learn more...
A-Tek llc

Complete the form below. After you hit submit you will be redirected to the White Paper page. Please be patient, it may take a few seconds for the White Paper to load.

This page has been viewed 116 times.