Minneapolis, MN - The SMTA, in conjunction with Chip Scale Review magazine, is pleased to release the Call for Papers for the 7th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition (IWLPC) to be held October 11-14, 2010 at the Marriott Santa Clara Hotel in Santa Clara, CA. The IWLPC Technical Chair, Lee Smith of Amkor Technology, and the IWLPC Technical Committee would like to invite you to submit an abstract for this program on or before April 23, 2010.
The conference will include three tracks in 2010 with two days of papers covering:
Wafer Level Packaging
MEMS Packaging
3-D Integration
This premier industry event explores leading-edge design, material, and process technologies focused on Wafer-Level Packaging applications. There will be special emphasis on the numerous device and end product applications (RF/wireless, sensors, mixed technology, optoelectronics) that demand wafer level packaging solutions for integration, cost, and performance requirements.
April 30, 2010 - Corporate News SMTA China Announces Winners of the 2010 Annual Awards SMTA China held its annual awards presentation at the SMTA China Annual Breakfast Reception, which took place on Wednesday, April 21, 2010 at ... SMTA
April 29, 2010 - Corporate News Call for Papers 2010 for the Technology Conference The SMTA China cordially invites you to participate in SMTA China South Conference located in Shenzhen for 2010. This event, held in conjunction ... SMTA
