VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection systems, announces that it will participate and propose X-ray and Rework solutions in Hall A4, Stand 533 at the upcoming Productronica exhibition, scheduled to take place November 10-13, 2009 at the New Munich Trade Fair Center in Munich, Germany.
On the Rework side, VJ Electronix will illustrate solder scavenging performed by the Summit Series and 400 Series.
The 400 Series Benchtop Rework Platform is capable of addressing challenging lead-free rework applications. The 400 Series is configurable with an arsenal of recently developed rework solutions for site dressing, BGA rework and through-hole rework eliminating copper dissolution.
The Summit Series Performance Rework Platform incorporates all of the innovative features that have been developed since the invention of high-level, semi-automatic surface mount and microelectronics rework technology.
Extensive field experience and user feedback have resulted in the development of a rework system that more than satisfies current and future industry requirements. SierraMateTM software with intuitive 1-2-3-GO operator interface and Auto Profile maximizes ease of use, while maintaining the inherent capability to rework the most complex area-array components (BGAs, micro BGAs, flip chips, CCGA, etc.).
On the X-ray side, VJ Electronix will display 2D, 2D off axis, 3D and CT X-ray inspection performed by the Vertex Series X-ray Inspection Platform. To meet significant industry challenges, the Vertex Series offers numerous features to help users inspect both electronic and non-electronic assemblies quickly and accurately. A new flexible design allows it to be customized to any inspection task.
The Vertex Series allows for faster load/unload product exchange; highly reproducible results based on repeatability of precision, programmable control system. Automation of the Vertex allows one operator to run multiple machines.
The Vertex offers an active inspection area of 508 x 610 mm with 100 percent coverage. The large board-handling table and large inspection area are especially important to suit large or multi-up assemblies. Its modular configuration allows customers to select multiple choices of X-ray sources, detectors and motion components, as well as multiple software modules to optimize the system for any application.
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