NASHVILLE — Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that it will feature MICRONOX® MX2302 wafer-level cleaning solution at the upcoming International Wafer-Level Packaging Conference and Tabletop Exhibition, scheduled to take place October 27-30, 2009 at the Santa Clara Marriott in Santa Clara, CA.

MICRONOX® MX2302 is an engineered semi-aqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and microBGA packages. MX2302 has proven effective in ultrasonic, centrifugal and semi-aqueous spray under immersion cleaning systems. Easy to use, MX2302 has excellent compatibility with all soldering materials, passivation layers (PI, Nitride, Silicon Dioxide, BCB, etc.) and metal layers.

MX2302 is compatible with all materials commonly used in electronics assembly, wafer bumping, and advanced packaging manufacturing and cleaning processes.

MICRONOX® MX2302 is a biodegradable non-flammable, non-corrosive solvent that contains no CFCs or HAPs. The Kyzen Applications Laboratory has evaluated MICRONOX MX2302 for effective removal of nearly 300 soldering materials from the world’s leading suppliers including, Senju, Alpha, Kester, Indium, Aim, Koki, Nihon Superior, Amtech, Cobar, EFD, Florida Cirtech, Formosa, Heraeus, Interflux, Metallic Resource, Multicore, Promosol, Qualitek and Shenmao.

MX2302 is available in one, five and 55 gallon containers.