The new SIPLACE X-Series powered by SIPLACE MultiStar delivers the ideal combination of chip shooting speed along with extensive component range capability required for flexible end of line placement. The versatile SIPLACE MultiStar is a high-speed collect&place placement head capable of placing up to 24,000 cph with a component range from 01005 to 27mm². The same MultiStar head can also place larger components up to 40 x 50mm.

The SIPLACE X-Series powered by the new SIPLACE MultiStar is the best possible all-in-one line balancing solution for today’s manufacturer because it enables electronics manufacturers to simplify line setup and programming, eliminate the need for line reconfiguration or head changes, and ensures optimal line balancing for higher productivity and lower operational costs.

With the new SIPLACE MultiStar manufacturers will have the ability to automatically choose the appropriate placement mode for respective components resulting in better line utilization and bottlenecks are eliminated. The SIPLACE X-Series powered by the new SIPLACE MultiStar breaks the paradigm between chip shooter and end of line machine because you have the ability to run it as a chip shooter and then take the whole machine and redeploy it as an end of line machine without reconfiguring any heads. There is no other placement head on the market today with this range of capability and speed.