South Plainfield, NJ -- Cookson Electronics continues its dominant solder paste product development efforts with the launch of ALPHA® CVP-360 Pb-free, no-clean solder paste formulated with its economical low-Ag SACX® 0807 and 0307 alloys. New CVP-360 will deliver high productivity and lowest cost of ownership with excellent in-circuit test yields.

“ALPHA® CVP-360 was developed to offer the highest value to assemblers of consumer electronics products. By enabling the use of lower silver SACX® alloys, CVP-360 can virtually eliminate the price volatility of silver, without eliminating the soldering benefits of silver from the alloy,” said Mitch Holtzer, Cookson’s Global Product manager. “CVP-360 also offers value with extremely high in-circuit pin test yields, and superior spread and wetting versus leading SAC 305 and SAC 405 solder pastes.”

ALPHA® CVP-360 delivers excellent printing characteristics allowing for the use of more economical Type-3 solder powder, even when 12 mil (300 micron) features are being printed using a 5 mil thick (125 micron) stencil. CVP-360 also adds value by allowing high speed printing, and reduced stencil cleaning frequency. This reduces the print cycle time, and lowers the cost of consumables, such as stencil cleaner and under-wipe paper. CVP-360 also has a wide reflow process window, which indicates resistance to head-in-pillow defects. This can also make a difference if older, or lower cost substrates and components are used.

In today's challenging economic conditions, value is more important than ever. ALPHA® CVP-360’s high print and reflow process yields, combined with the economy of its low-Ag SACX® alloys with Type-3 powder, allows assemblers to keep SMT manufacturing costs competitive.

More information, go to: (OM-360 product home page on website)