Chandler, AZ - Rogers Corporation (NYSE:ROG), a leading supplier of high frequency laminates, will announce the launch of another new member to its family of advanced circuit materials at the 2009 International Microwave Symposium (IEEE MTT-S) to be held at the Boston Convention & Exhibition Center June 9^th-11th (Booth # 1018.)

The Advanced Circuit Materials Division will also be showcasing recently introduced materials especially targeted to meet next generation material requirements for the microwave industry:

RO4000® LOPRO™ Laminates

RO4000 LoPro laminates implement a special interface technology to enable the use of a very low profile reverse-treat copper foil while maintaining copper peel strength equal to or better than standard RO4000 materials. RO4000 LoPro laminates combine the best-in-class electrical and thermo-mechanical reliability of RO4000 laminates with improved insertion loss and outstanding passive intermodulation (PIM) characteristics.

RT/duroid® 5880LZ Laminates

The award winning RT/duroid 5880LZ material is a PTFE composite designed for exacting stripline and microstrip circuit applications. This groundbreaking filler system results in a low density (1.37 gm/cm³), lightweight material, making it an ideal choice for high performance weight sensitive applications such as airborne antennas. RT/duroid 5880LZ laminate has a dielectric constant (Dk) of 1.96 @ 10 GHz, providing the lowest Dk of a copper clad microwave material available today. In addition, the dielectric constant is uniform from panel-to-panel and constant over a wide frequency range, with a low z-axis TCDk of +22 ppm/°C. Its low dissipation factor extends the usefulness of RT/duroid 5880LZ to Ku-band and above.

In addition, the following well known commercial grade materials for high performance applications will be on display:

RO3000® Laminates: Features low dielectric loss for high frequency applications; uniform mechanical properties, ideal for multilayer boards; as well as stable Dk versus frequency and temperature.

R/flex® 8080 Photoimageable Covercoat Materials: Designed to provide uniform coverage in mass production applications, Rogers R/flex 8080 enables printed circuit board manufacturers to achieve ultra-fine, high precision etch patterns that have traditionally been unattainable through conventional screen printing. The photoimageable covercoat materials provide outstanding imaging resolution, flexibility and creaseability, required for developing today's high-density flexible printed circuits.