Chandler, AZ - Rogers Corporation (NYSE:ROG), a leading supplier of high frequency laminates will be promoting important new members to its family of advanced circuit materials at the Del Mar Electronics Show 2009 held at the Del Mar Fairgrounds in San Diego, California May 6^th and 7^th (Booth #622.)

Highlights include:

RO4000® LoPro™ Laminates

RO4000 LoPro laminates implement a special interface technology to enable the use of a very low profile reverse-treat copper foil while maintaining copper peel strength equal to or better than standard RO4000 materials. RO4000 LoPro laminates combine the best-in-class electrical and thermo-mechanical reliability of RO4000 laminates with improved insertion loss and outstanding passive intermodulation (PIM) characteristics.

RT/duroid® 5880LZ Laminates

The award winning RT/duroid 5880LZ material is a PTFE composite designed for exacting stripline and microstrip circuit applications. Our ground-breaking filler system results in a low density (1.37 gm/cm³), lightweight material making it an ideal choice for high performance weight sensitive applications such as airborne antennas. RT/duroid 5880LZ laminate has a dielectric constant (Dk) of 1.96 @ 10 GHz, providing the lowest Dk of a copper clad microwave material available today. With an exceptional TCDK (thermal coefficient of dielectric constant) of 22 PPM/°C, 5880LZ enables consistent circuit performance and stable dielectric constant versus temperature. In addition, the dielectric constant is uniform from panel-to-panel and constant over a wide frequency range. Its low dissipation factor extends the usefulness of RT/duroid 5880LZ to Ku-band and above.

In addition, the following well known commercial grade materials for high performance applications will be on display:

RO3000® laminates: Features low dielectric loss for high frequency applications; uniform mechanical properties, ideal for multi-layer board; as well as stable Dk versus frequency and temperature.

R/flex® 8080 Photoimageable Covercoat Materials: Designed to provide uniform coverage in mass production applications, the Rogers' R/flex 8080 enables printed circuit board manufacturers to achieve ultra-fine, high precision etch patterns that have traditionally been unattainable through conventional screen printing. The photoimageable covercoat materials provide outstanding imaging resolution, flexibility and creaseability, as required for developing today's high-density flexible printed circuits.