South Plainfield, NJ – Cookson Electronics is pleased to announce the launch of ALPHA® WS-820 halide-free, lead-free, water-soluble solder paste. This new product offers excellent printability with print volume and print repeatability down to 12 mil (0.3mm) features, and it has an excellent reflow process window with straight ramp, short soak or long soak profiles in air.

“WS-820 is the latest generation water soluble, lead free paste in ALPHA's long tradition of manufacturing high performance solder pastes. It is a designed to provide excellent print performance at both low and high relative humidity (20% to 65%), and it offers IPC 7095 Class III resistance to voiding. WS-820 is also very easy to clean with warm de-ionized water, leaving virtually no ionic contamination behind,” said Mitch Holtzer, ALPHA’s Global Product Manager.

“Customer response has been terrific. Our robust, phase gate development process has created the lead-free water-soluble paste that our customers have been asking for,” Holtzer added.

Available in SAC305 and SAC405 alloys and in Type 3 and 4 powder, ALPHA WS-820 delivers excellent wetting characteristics on all common surface finishes, including Entek HT OSP. As many electrics assemblers explore the conversion to lead-free water-soluble surface mount applications, WS-820 will allow a wide variety of them make the transition without sacrificing printability and first pass yields.