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SMT & BLR Study for TMV PoP
White paper published SMTA Int'l Aug 2008 by Amkor and Sony Ericsson for stacking and board level reliability study of TMV PoP for next generation high density package on package requirements. Amkor Complete the form below. After you hit submit you will be redirected to the White Paper page. Please be patient, it may take a few seconds for the White Paper to load. | ||
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