White Paper Download Index Using Argon Plasma to Improved Wire Bonding Performance Commercially-available Argon plasma cleaning systems can be used for effectively cleaning Fluorine, organic, and metal oxide contamination from the surface of a variety of microelectronic wire bonding pads in order to measurably improve the performance and reliability of wire bonding... March Plasma Systems Complete the form below. After you hit submit you will be redirected to the White Paper page. Please be patient, it may take a few seconds for the White Paper to load. Page views: 861 White Paper Submission Guidelines - White Paper Submit Form Semiconductor Packaging News reaches industry professionals involved in semiconductor packaging and microelectronics. If you have a technical white paper, post at no cost for readers to learn more about your technology. Our readers are interested in technical solutions. White Papers should not promote the sale of a product or service. Please limit your White Paper length to 5 pages or less. Keep the reader in mind - shorter is always better. White Papers should be submitted as PDF files less than 2 Megs.