White Paper Download Index A Next Generation Process for Moisture Sensitive Devices The influence of humidity on the reliability of electronic components is generally underestimated and often simply unknown. Moisture sensitive devices (MSDs) are electronic components encapsulated with plastic compounds and other organic materials. Moisture from atmospheric humidity enters these permeable packaging materials by diffusion and collects at the interfaces of dissimilar material ... Totech Complete the form below. After you hit submit you will be redirected to the White Paper page. Please be patient, it may take a few seconds for the White Paper to load. Page views: 5120 White Paper Submission Guidelines - White Paper Submit Form Semiconductor Packaging News reaches industry professionals involved in semiconductor packaging and microelectronics. If you have a technical white paper, post at no cost for readers to learn more about your technology. Our readers are interested in technical solutions. White Papers should not promote the sale of a product or service. Please limit your White Paper length to 5 pages or less. Keep the reader in mind - shorter is always better. White Papers should be submitted as PDF files less than 2 Megs.