MADISON, AL — STI Electronics, Inc., a full service organization providing training, consulting, electronic and industrial product distribution, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that Mark T. McMeen, V.P. of Engineering Services, will present during the 2009 Pan Pacific Microelectronics Symposium and Tabletop Exhibition. The presentation will take place on Wednesday, February 11, 2009 from 9-10 a.m. during Session WA2 on Thermal Studies and is titled, “Strain Gage Testing: The Delta Effect of Thermal Cycle Testing.”

STI’s Analytical Lab has taken a lead role in strain gage testing and data evaluation of applied strain and strain rate on printed circuit card assemblies. This article looks at one case study of failed hardware and the underlying failure mechanisms of temperature cycling.

The 2009 Pan Pacific Microelectronics Symposium will be held on the Big Island of Hawaii from February 10-12, 2009. This event promotes international technical interchange and provides a premier forum for extensive networking among microelectronics professionals and business leaders throughout the Pacific Basin.

Sponsored by the SMTA, the Symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems, nanotechnology, and assembly.

For more information about STI’s Presentation or to view the program for the exhibition, please visit http://www.smta.org/panpac/index.cfm.