We search for industry news, so you don't need to.
|
|
|
| February 8, 2012
|
| |
Circulation Over 51,000
|
|
Viewpoint 2009
April 6, 2009
Can La, Product Manager, Techcon Systems
As components are getting smaller, manufacturing processes will need to be adjusted to meet new requirements, especially in the adhesive dispensing process. A new positive displacement dispensing technology is being developed that will allow PCB assemblers to dispense smaller shots accurately and consistently while reducing manufacturing cost.
Can La, Product Manager
Techcon Systems, a brand of OK International
Click here to see all Viewpoints from
Can La, Product Manager, Techcon Systems
February 8, 2012
Mike Scimeca, President, FCT Assembly
FCT Assembly is gearing up for 2012 with the introduction of new equipment, new employees, expansion into new markets and a focus on our unique products ...
|
February 8, 2012
Carsten Salewski, President / CEO, Viscom, Inc.
We are carefully optimistic and believe that business will continue in 2012 the same way that made 2011 so successful for Viscom -- very strong business ...
|
February 7, 2012
Markus Wilkens, President, ASYS Group
Finishing off 2011 with the strongest order back log ever, we are confidently looking forward to a promising 2012. We have seen a lot of European ...
|
February 7, 2012
John Perrotta, Vice President, Europlacer North America
Europlacer North America had a very strong year in 2011, with a 50% revenue increase in sales over 2010. With market conditions expected to improve next ...
|
February 6, 2012
Andrew Zosel, Vice President, Microscan Systems
Microscan expects the extremely high growth trends of 2010 and 2011 to soften slightly in 2012, but is still planning on a strong growth year in 2012. In the ...
|
|
|
|
|
|
