Bondtesting of Overhanging Die
New test software is required to achieve virtually zero landing force when testing the bond strength of ball bonds on overhanging die within semiconductor packaging. This article looks at the challenges and solutions to performing bond shear on overhanging die surfaces.
Dage Precision Industies
Complete the form below. After you hit submit you will be redirected to the White Paper page. Please be patient, it may take a few seconds for the White Paper to load.
|