White Paper Download Index Bondtesting of Overhanging Die New test software is required to achieve virtually zero landing force when testing the bond strength of ball bonds on overhanging die within semiconductor packaging. This article looks at the challenges and solutions to performing bond shear on overhanging die surfaces. Dage Precision Industies Complete the form below. After you hit submit you will be redirected to the White Paper page. Please be patient, it may take a few seconds for the White Paper to load. Page views: 796 White Paper Submission Guidelines - White Paper Submit Form Semiconductor Packaging News reaches industry professionals involved in semiconductor packaging and microelectronics. If you have a technical white paper, post at no cost for readers to learn more about your technology. Our readers are interested in technical solutions. White Papers should not promote the sale of a product or service. Please limit your White Paper length to 5 pages or less. Keep the reader in mind - shorter is always better. White Papers should be submitted as PDF files less than 2 Megs.