|
[an error occurred while processing this directive]
|
White Paper Submission Guidelines
The daily Circuitnet e-mail newsletter and web site reaches over 300,000 industry professionals involved in electronics manufacturing and assembly.
If you have a technical white paper, post at no cost for readers to learn more about your technology.
White Paper Submit Form
Our readers are interested in technical solutions to the issues faced by electronics assembly industry professionals. White Papers should not promote the sale of a product or service.
Please limit your White Paper length to 5 pages or less. Keep the reader in mind - shorter is always better.
White Papers should be submitted as PDF files less than 2 Megs.
|
Identifying Flip Chip Defects
This article examines the use of 2D and 3D x-ray techniques to find and confirm manufacturing defects in flip-chip devices mounted on production circuit boards within the assembly process, thus increasing quality levels and improving yields.
Dage Precision Industries
Complete the form below. After you hit submit you will be redirected to the White Paper page. Please be patient, it may take a few seconds for the White Paper to load.
This page has been viewed 1014 times.
|
[an error occurred while processing this directive]
|
|
|
[an error occurred while processing this directive]
|