White Paper Download Index A Dry Film Solution for Advanced Packaging For wafer bumping and copper pillar packaging fabs, DuPont Advanced Packaging Lithography offers a high performance thick photoresist dry film that delivers superior thickness uniformity, fine pitch capability and clean removal with high productivity and low cost of ownership. DuPont Complete the form below. After you hit submit you will be redirected to the White Paper page. Please be patient, it may take a few seconds for the White Paper to load. Page views: 761 White Paper Submission Guidelines - White Paper Submit Form Semiconductor Packaging News reaches industry professionals involved in semiconductor packaging and microelectronics. If you have a technical white paper, post at no cost for readers to learn more about your technology. Our readers are interested in technical solutions. White Papers should not promote the sale of a product or service. Please limit your White Paper length to 5 pages or less. Keep the reader in mind - shorter is always better. White Papers should be submitted as PDF files less than 2 Megs.